Single Side 20*30cm Thickness 1.5mm FR4 Glass Fiber Blank Copper Clad Board

Material:

• Base Material: FR4 (Flame Retardant Glass-Reinforced Epoxy Laminate)
• Cladding: Single-sided copper cladding (usually a thin layer of copper on one side of the board)
• Copper Thickness: Generally ranges from 35µm to 70µm (1 oz/ft² or 2 oz/ft²) depending on the specific type.

Dimensions:

• Length: 30 cm
• Width: 20 cm
• Thickness: 1.5 mm

Mechanical Properties:

• Flexural Strength: Typically 415 MPa (parallel to the lamination)
• Tensile Strength: Approximately 310 MPa
• Compressive Strength: Around 500 MPa
• Shear Strength: 210 MPa
• Density: 1.85-1.9 g/cm³

Thermal Properties:

• Glass Transition Temperature (Tg): Typically between 120°C and 150°C for standard FR4 boards.
• Decomposition Temperature (Td): Above 300°C
• Thermal Conductivity: Approximately 0.3 W/(m·K)
• Coefficient of Thermal Expansion (CTE):
  • Z-axis: ~70 ppm/°C below Tg
  • X/Y-axis: ~13-17 ppm/°C

Electrical Properties:

• Dielectric Constant (εr): ~4.4 to 4.8 at 1 MHz
• Dissipation Factor (tan δ): ~0.02 at 1 MHz
• Volume Resistivity: 1 x 10⁶ MΩ·cm (minimum)
• Surface Resistivity: 1 x 10⁴ MΩ (minimum)
• Dielectric Strength: ~20 kV/mm

Chemical Resistance:

• Resistant to: Most solvents, chemicals, and moisture due to the glass fiber structure.
• Water Absorption: Less than 0.1%.